DSPIC30F4011AT-20I/ML
vs
DSPIC30F4011AT-20E/P
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
QFN-44
|
,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
|
|
| Bit Size |
16
|
|
| Boundary Scan |
NO
|
|
| Clock Frequency-Max |
40 MHz
|
25 MHz
|
| External Data Bus Width |
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
NO
|
|
| JESD-30 Code |
S-PQCC-N44
|
|
| Length |
8 mm
|
|
| Low Power Mode |
NO
|
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
3
|
|
| Number of Serial I/Os |
2
|
|
| Number of Terminals |
44
|
|
| Number of Timers |
5
|
|
| On Chip Data RAM Width |
16
|
|
| On Chip Program ROM Width |
24
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
HVQCCN
|
|
| Package Equivalence Code |
LCC44,.32SQ,25
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
| ROM Programmability |
FLASH
|
|
| Seated Height-Max |
1 mm
|
|
| Supply Current-Max |
170 mA
|
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
2.5 V
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
NO LEAD
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
QUAD
|
|
| Width |
8 mm
|
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare DSPIC30F4011AT-20I/ML with alternatives
Compare DSPIC30F4011AT-20E/P with alternatives