DSPIC33EP256GP504-I/ML
vs
DSPIC33EP256GP502-E/SP
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Part Package Code |
QFN
|
DIP
|
| Package Description |
Hvqccn, Lcc44,.32sq,25
|
Dip, Dip28,.3
|
| Pin Count |
44
|
28
|
| Manufacturer Package Code |
QFN-44
|
SPDIP-28
|
| Reach Compliance Code |
Compliant
|
Compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
6 Weeks
|
6 Weeks
|
| Address Bus Width |
|
|
| Barrel Shifter |
Yes
|
Yes
|
| Bit Size |
16
|
16
|
| Boundary Scan |
Yes
|
Yes
|
| Clock Frequency-Max |
60 Mhz
|
60 Mhz
|
| External Data Bus Width |
|
|
| Format |
Fixed Point
|
Fixed Point
|
| Integrated Cache |
No
|
No
|
| Internal Bus Architecture |
Multiple
|
Multiple
|
| JESD-30 Code |
S-PQCC-N44
|
R-PDIP-T28
|
| JESD-609 Code |
e3
|
e3
|
| Length |
8 Mm
|
34.671 Mm
|
| Low Power Mode |
Yes
|
Yes
|
| Moisture Sensitivity Level |
1
|
|
| Number of DMA Channels |
4
|
4
|
| Number of External Interrupts |
3
|
3
|
| Number of Terminals |
44
|
28
|
| Number of Timers |
5
|
5
|
| On Chip Data RAM Width |
8
|
8
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
Plastic/Epoxy
|
Plastic/Epoxy
|
| Package Code |
HVQCCN
|
DIP
|
| Package Equivalence Code |
LCC44,.32SQ,25
|
DIP28,.3
|
| Package Shape |
Square
|
Rectangular
|
| Package Style |
Chip Carrier, Heat Sink/Slug, Very Thin Profile
|
In-Line
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
32768
|
32768
|
| ROM Programmability |
Flash
|
Flash
|
| Screening Level |
Ts 16949
|
Ts 16949
|
| Seated Height-Max |
1 Mm
|
5.08 Mm
|
| Supply Current-Max |
55 Ma
|
55 Ma
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
Yes
|
No
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Industrial
|
Automotive
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
No Lead
|
Through-Hole
|
| Terminal Pitch |
0.65 Mm
|
2.54 Mm
|
| Terminal Position |
Quad
|
Dual
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
8 Mm
|
7.62 Mm
|
| uPs/uCs/Peripheral ICs Type |
Digital Signal Processor, Controller
|
Digital Signal Processor, Controller
|
| Base Number Matches |
1
|
1
|
|
|
|