DSPIC33EV32GM006-E/PT
vs
DSPIC33EV128GM004T-H/MR
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
TQFP-64
|
,
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
6 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Address Bus Width |
|
|
| Barrel Shifter |
YES
|
|
| Bit Size |
16
|
|
| Boundary Scan |
NO
|
|
| Clock Frequency-Max |
40 MHz
|
|
| External Data Bus Width |
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
NO
|
|
| Internal Bus Architecture |
MULTIPLE
|
|
| JESD-30 Code |
S-PQFP-G64
|
|
| JESD-609 Code |
e3
|
|
| Length |
10 mm
|
|
| Low Power Mode |
YES
|
|
| Number of DMA Channels |
4
|
|
| Number of External Interrupts |
3
|
|
| Number of Terminals |
64
|
|
| Number of Timers |
7
|
|
| On Chip Data RAM Width |
8
|
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TFQFP
|
|
| Package Equivalence Code |
TQFP64,.47SQ
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
|
| Qualification Status |
Not Qualified
|
|
| RAM (words) |
4096
|
|
| ROM Programmability |
FLASH
|
|
| Screening Level |
AEC-Q100; TS 16949
|
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Current-Max |
350 mA
|
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Width |
10 mm
|
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8542.31.00.01
|
|
|
|
Compare DSPIC33EV32GM006-E/PT with alternatives
Compare DSPIC33EV128GM004T-H/MR with alternatives