DSPIC33EV64GM102-M/MM
vs
DSPIC33EV64GM102-H/MM
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
,
|
QFN-28
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
|
| Technology |
CMOS
|
CMOS
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Address Bus Width |
|
|
| Barrel Shifter |
|
YES
|
| Bit Size |
|
16
|
| Boundary Scan |
|
NO
|
| Clock Frequency-Max |
|
40 MHz
|
| External Data Bus Width |
|
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
NO
|
| Internal Bus Architecture |
|
MULTIPLE
|
| JESD-30 Code |
|
S-PQCC-N28
|
| Length |
|
6 mm
|
| Low Power Mode |
|
YES
|
| Number of DMA Channels |
|
4
|
| Number of External Interrupts |
|
3
|
| Number of Terminals |
|
28
|
| Number of Timers |
|
7
|
| On Chip Data RAM Width |
|
8
|
| On Chip Program ROM Width |
|
8
|
| Operating Temperature-Max |
|
150 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
HVQCCN
|
| Package Equivalence Code |
|
LCC28,.24SQ,25
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
|
Not Qualified
|
| RAM (words) |
|
8192
|
| ROM Programmability |
|
FLASH
|
| Screening Level |
|
AEC-Q100; TS 16949
|
| Seated Height-Max |
|
1 mm
|
| Supply Current-Max |
|
350 mA
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Supply Voltage-Nom |
|
5 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Form |
|
NO LEAD
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
6 mm
|
|
|
|
Compare DSPIC33EV64GM102-M/MM with alternatives
Compare DSPIC33EV64GM102-H/MM with alternatives