DSPIC33EV64GM104T-H/MLVAO
vs
DSPIC30F3012AT-30ISO-ES
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
QFN-44
|
0.300 INCH, PLASTIC, MS-013, SOIC-18
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
|
|
| Barrel Shifter |
YES
|
|
| Bit Size |
16
|
16
|
| Boundary Scan |
NO
|
|
| Clock Frequency-Max |
40 MHz
|
40 MHz
|
| External Data Bus Width |
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
NO
|
|
| Internal Bus Architecture |
MULTIPLE
|
|
| JESD-30 Code |
S-PQCC-N44
|
R-PDSO-G18
|
| Length |
8 mm
|
11.53 mm
|
| Low Power Mode |
YES
|
|
| Number of DMA Channels |
4
|
|
| Number of External Interrupts |
3
|
|
| Number of Terminals |
44
|
18
|
| Number of Timers |
9
|
|
| On Chip Data RAM Width |
8
|
|
| On Chip Program ROM Width |
8
|
24
|
| Operating Temperature-Max |
150 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
SOP
|
| Package Equivalence Code |
LCC44,.31SQ,25
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| RAM (words) |
8192
|
|
| ROM Programmability |
FLASH
|
FLASH
|
| Screening Level |
AEC-Q100; TS 16949
|
|
| Seated Height-Max |
1 mm
|
2.64 mm
|
| Supply Current-Max |
60 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
2.5 V
|
| Supply Voltage-Nom |
5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
8 mm
|
7.49 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
18
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
Matte Tin (Sn)
|
|
|
|
Compare DSPIC33EV64GM104T-H/MLVAO with alternatives
Compare DSPIC30F3012AT-30ISO-ES with alternatives