DSPIC33FJ128GP706AE/MR vs DSPIC33FJ128GP708A-I/PT feature comparison

DSPIC33FJ128GP706AE/MR Microchip Technology Inc

Buy Now Datasheet

DSPIC33FJ128GP708A-I/PT Microchip Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code QFN QFP
Package Description HVQCCN, LCC64,.35SQ,20 12 X 12 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, TQFP-80
Pin Count 64 80
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width
Barrel Shifter YES YES
Bit Size 16 16
Clock Frequency-Max 40 MHz 40 MHz
External Data Bus Width
Format FIXED POINT FIXED POINT
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PQCC-N64 S-PQFP-G80
JESD-609 Code e3 e3
Length 9 mm 12 mm
Moisture Sensitivity Level 3 3
Number of Terminals 64 80
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN TQFP
Package Equivalence Code LCC64,.35SQ,20 TQFP80,.55SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE FLATPACK, THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
ROM Programmability FLASH FLASH
Seated Height-Max 1 mm 1.2 mm
Supply Current-Max 90 mA 90 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40 40
Width 9 mm 12 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, CONTROLLER DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches 1 1
Factory Lead Time 7 Weeks
Samacsys Manufacturer Microchip

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