EDI8F81027C100B6C vs DPS1MX8MKN3-25I feature comparison

EDI8F81027C100B6C White Electronic Designs Corp

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DPS1MX8MKN3-25I B&B Electronics Manufacturing Company

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer WHITE ELECTRONIC DESIGNS CORP DPAC TECHNOLOGIES CORP
Package Description DIP-32 DIP, DIP32,.6
Reach Compliance Code unknown unknown
Access Time-Max 100 ns 25 ns
JESD-30 Code R-XDMA-T32 R-CDMA-T32
Memory Density 8388608 bit 8388608 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1MX8 1MX8
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 1 2
Part Package Code MODULE
Pin Count 32
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
I/O Type COMMON
JESD-609 Code e0
Number of Ports 1
Output Characteristics 3-STATE
Output Enable NO
Package Code DIP
Package Equivalence Code DIP32,.6
Standby Current-Max 0.0016 A
Standby Voltage-Min 2 V
Supply Current-Max 0.24 mA
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

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