EDI8F8512C35M6C vs 5962-9561312HYX feature comparison

EDI8F8512C35M6C White Electronic Designs Corp

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5962-9561312HYX Cobham Semiconductor Solutions

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WHITE ELECTRONIC DESIGNS CORP AEROFLEX COLORADO SPRINGS
Package Description DIP-32 DIP,
Reach Compliance Code unknown unknown
Access Time-Max 35 ns 35 ns
I/O Type COMMON
JESD-30 Code R-XDMA-T32 R-CDIP-T32
Memory Density 4194304 bit 4194304 bit
Memory IC Type SRAM MODULE STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 512KX8 512KX8
Output Characteristics 3-STATE
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.04 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.39 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 1 1
Part Package Code DIP
Pin Count 32
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Length 41.525 mm
Screening Level MIL-PRF-38534 Class H
Seated Height-Max 5.13 mm
Width 15.24 mm

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Compare 5962-9561312HYX with alternatives