ESD5Z3.3T1G
vs
ESD3V3D5
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ONSEMI
|
MICRO COMMERCIAL COMPONENTS CORP
|
| Part Package Code |
SOD-523 2 LEAD
|
|
| Package Description |
0.047 X 0.032 INCH, 0.028 INCH HEIGHT, ROHS COMPLIANT, PLASTIC, CASE 502-01, 2 PIN
|
PLASTIC PACKAGE-2
|
| Pin Count |
2
|
2
|
| Manufacturer Package Code |
502-01
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Factory Lead Time |
2 Days
|
|
| Samacsys Manufacturer |
onsemi
|
MCC
|
| Breakdown Voltage-Min |
5 V
|
5 V
|
| Clamping Voltage-Max |
8.4 V
|
13 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JESD-30 Code |
R-PDSO-F2
|
R-PDSO-F2
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
1
|
|
| Non-rep Peak Rev Power Dis-Max |
158 W
|
158 W
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.2 W
|
0.2 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Standard |
IEC-61000-4-2, 4-4; UL RECOGNIZED
|
|
| Rep Pk Reverse Voltage-Max |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
AVALANCHE
|
AVALANCHE
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
2
|
7
|
|
|
|
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