FR1606GD
vs
STTH2003CT
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TAIWAN SEMICONDUCTOR CO LTD
|
STMICROELECTRONICS
|
| Package Description |
R-PSFM-T3
|
PLASTIC PACKAGE-3
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Additional Feature |
HIGH RELIABILITY
|
SOFT FACTOR IS 0.3
|
| Application |
FAST RECOVERY
|
ULTRA FAST SOFT RECOVERY
|
| Case Connection |
ANODE AND CATHODE
|
|
| Configuration |
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
COMMON CATHODE, 2 ELEMENTS
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.3 V
|
1.3 V
|
| JEDEC-95 Code |
TO-220AB
|
TO-220AB
|
| JESD-30 Code |
R-PSFM-T3
|
R-PSFM-T3
|
| Moisture Sensitivity Level |
1
|
|
| Non-rep Pk Forward Current-Max |
150 A
|
110 A
|
| Number of Elements |
2
|
2
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
150 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
|
| Output Current-Max |
16 A
|
10 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Rep Pk Reverse Voltage-Max |
800 V
|
300 V
|
| Reverse Current-Max |
5 µA
|
|
| Reverse Recovery Time-Max |
0.5 µs
|
0.035 µs
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
TO-220AB
|
| Pin Count |
|
3
|
| Factory Lead Time |
|
15 Weeks
|
| Samacsys Manufacturer |
|
STMicroelectronics
|
| JESD-609 Code |
|
e3
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare FR1606GD with alternatives
Compare STTH2003CT with alternatives