FSUSB30BQX
vs
FSUSB30L10X
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
HVQCCN,
|
VQCCN,
|
| Pin Count |
14
|
10
|
| Reach Compliance Code |
unknown
|
unknown
|
| Analog IC - Other Type |
DPDT
|
DPDT
|
| JESD-30 Code |
R-XQCC-N14
|
R-XQCC-N10
|
| JESD-609 Code |
e4
|
|
| Length |
3 mm
|
2.1 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
10
|
| Off-state Isolation-Nom |
30 dB
|
30 dB
|
| On-state Resistance Match-Nom |
0.35 Ω
|
0.35 Ω
|
| On-state Resistance-Max (Ron) |
10 Ω
|
10 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
VQCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.8 mm
|
0.55 mm
|
| Supply Voltage-Max (Vsup) |
4.3 V
|
4.3 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
25 ns
|
25 ns
|
| Switch-on Time-Max |
30 ns
|
30 ns
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NOT SPECIFIED
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
2.5 mm
|
1.6 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare FSUSB30BQX with alternatives
Compare FSUSB30L10X with alternatives