GBPC3506 vs MP356 feature comparison

GBPC3506 HY Electronic Corp

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MP356 Microsemi Corporation

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Rohs Code Yes
Part Life Cycle Code Contact Manufacturer Transferred
Ihs Manufacturer HY ELECTRONIC CORP MICROSEMI CORP
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.80 8541.10.00.80
Configuration BRIDGE, 4 ELEMENTS BRIDGE, 4 ELEMENTS
Diode Element Material SILICON SILICON
Diode Type BRIDGE RECTIFIER DIODE BRIDGE RECTIFIER DIODE
Forward Voltage-Max (VF) 1.1 V 1.2 V
JESD-30 Code S-PUFM-D4 S-PUFM-D4
Non-rep Pk Forward Current-Max 400 A 400 A
Number of Elements 4 4
Number of Phases 1 1
Number of Terminals 4 4
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -55 °C
Output Current-Max 35 A 35 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape SQUARE SQUARE
Package Style FLANGE MOUNT FLANGE MOUNT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Rep Pk Reverse Voltage-Max 600 V 600 V
Surface Mount NO NO
Terminal Form SOLDER LUG SOLDER LUG
Terminal Position UPPER UPPER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 26 8
Package Description S-PUFM-D4
Pin Count 4
JESD-609 Code e0
Qualification Status Not Qualified
Terminal Finish TIN LEAD

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