GBU610
vs
GBU6M
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
LITE-ON SEMICONDUCTOR CORP
|
DIOTEC SEMICONDUCTOR AG
|
| Package Description |
PLASTIC, GBU, 4 PIN
|
20.80 X 18 MM, 3.30 MM HEIGHT, ROHS COMPLIANT, PLASTIC PACKAGE-4
|
| Pin Count |
4
|
4
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Date Of Intro |
1999-08-09
|
|
| Breakdown Voltage-Min |
1000 V
|
|
| Case Connection |
ISOLATED
|
|
| Configuration |
BRIDGE, 4 ELEMENTS
|
BRIDGE, 4 ELEMENTS
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
BRIDGE RECTIFIER DIODE
|
BRIDGE RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1 V
|
1 V
|
| JESD-30 Code |
R-PSFM-T4
|
R-PSFM-T4
|
| JESD-609 Code |
e3/e4
|
|
| Non-rep Pk Forward Current-Max |
175 A
|
250 A
|
| Number of Elements |
4
|
4
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
4
|
4
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-50 °C
|
| Output Current-Max |
2.8 A
|
4.2 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Standard |
UL RECOGNIZED
|
UL RECOGNIZED
|
| Rep Pk Reverse Voltage-Max |
1000 V
|
1000 V
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
MATTE TIN/SILVER
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
1
|
2
|
| Samacsys Manufacturer |
|
Diotec
|
| Moisture Sensitivity Level |
|
1
|
| Reverse Current-Max |
|
5 µA
|
| Reverse Recovery Time-Max |
|
1.5 µs
|
| Reverse Test Voltage |
|
1000 V
|
|
|
|
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