GBU8M
vs
RS801
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Not Recommended
|
| Ihs Manufacturer |
DIOTEC SEMICONDUCTOR AG
|
MICRO COMMERCIAL COMPONENTS
|
| Pin Count |
4
|
4
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Samacsys Manufacturer |
Diotec
|
|
| Configuration |
BRIDGE, 4 ELEMENTS
|
BRIDGE, 4 ELEMENTS
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
BRIDGE RECTIFIER DIODE
|
BRIDGE RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1 V
|
1.1 V
|
| JESD-30 Code |
R-PSFM-T4
|
R-PSIP-W4
|
| JESD-609 Code |
e3
|
e0
|
| Moisture Sensitivity Level |
1
|
1
|
| Non-rep Pk Forward Current-Max |
200 A
|
300 A
|
| Number of Elements |
4
|
4
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
4
|
4
|
| Operating Temperature-Max |
150 °C
|
|
| Operating Temperature-Min |
-50 °C
|
|
| Output Current-Max |
5.6 A
|
8 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Standard |
UL RECOGNIZED
|
|
| Rep Pk Reverse Voltage-Max |
1000 V
|
50 V
|
| Reverse Current-Max |
5 µA
|
10 µA
|
| Reverse Recovery Time-Max |
1.5 µs
|
|
| Reverse Test Voltage |
1000 V
|
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
WIRE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Base Number Matches |
2
|
8
|
| Package Description |
|
R-PSIP-W4
|
| Breakdown Voltage-Min |
|
50 V
|
|
|
|
Compare GBU8M with alternatives
Compare RS801 with alternatives