GC4602-172
vs
GC4602-173
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
ROHS COMPLIANT PACKAGE-2
|
ROHS COMPLIANT PACKAGE-2
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Additional Feature |
LOW DISTORTION
|
LOW DISTORTION
|
| Application |
ATTENUATOR; SWITCHING
|
ATTENUATOR; SWITCHING
|
| Breakdown Voltage-Min |
2000 V
|
2000 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Capacitance-Max |
1 pF
|
1 pF
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Forward Resistance-Max |
0.25 Ω
|
0.25 Ω
|
| Diode Res Test Current |
500 mA
|
500 mA
|
| Diode Res Test Frequency |
100 MHz
|
100 MHz
|
| Diode Type |
PIN DIODE
|
PIN DIODE
|
| Frequency Band |
ULTRA HIGH FREQUENCY
|
ULTRA HIGH FREQUENCY
|
| JESD-30 Code |
O-CEMW-N2
|
O-CEMW-N2
|
| JESD-609 Code |
e4
|
e4
|
| Minority Carrier Lifetime-Nom |
10 µs
|
10 µs
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
MICROWAVE
|
MICROWAVE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
| Terminal Finish |
GOLD
|
GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
END
|
END
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare GC4602-172 with alternatives
Compare GC4602-173 with alternatives