GC5018IZDL
vs
AWT6271M7P8
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ANADIGICS INC
|
Part Package Code |
BGA
|
MODULE
|
Package Description |
BGA-305
|
HLSON,
|
Pin Count |
305
|
10
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B305
|
S-XDSO-N10
|
JESD-609 Code |
e1
|
|
Length |
19 mm
|
4 mm
|
Moisture Sensitivity Level |
3
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
305
|
10
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
BGA
|
HLSON
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.02 mm
|
1.61 mm
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Telecom IC Type |
RF AND BASEBAND CIRCUIT
|
RF AND BASEBAND CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
1 mm
|
0.85 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
19 mm
|
4 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare GC5018IZDL with alternatives
Compare AWT6271M7P8 with alternatives