GD25Q64BFIGT vs W25Q64FVSFIG feature comparison

GD25Q64BFIGT ELM Technology Corp

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W25Q64FVSFIG Winbond Electronics Corp

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Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer ELM TECHNOLOGY CORP WINBOND ELECTRONICS CORP
Package Description SOP-16 SOIC-16
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 120 MHz 104 MHz
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 10.3 mm 10.31 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX8 8MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 2.7 V 3 V
Seated Height-Max 2.75 mm 2.64 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Type NOR TYPE
Width 7.52 mm 7.49 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 16
Samacsys Manufacturer Winbond
Alternate Memory Width 1
Data Retention Time-Min 20
Output Characteristics 3-STATE
Package Equivalence Code SOP16,.4
Qualification Status Not Qualified
Serial Bus Type SPI
Standby Current-Max 0.00005 A
Write Protection HARDWARE/SOFTWARE

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