GS816132DGD-200V
vs
GS816132DD-375T
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
GSI TECHNOLOGY
|
GSI TECHNOLOGY
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LBGA,
|
LBGA,
|
| Pin Count |
165
|
165
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.B.2.B
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Factory Lead Time |
24 Weeks
|
|
| Access Time-Max |
6.5 ns
|
4.2 ns
|
| Additional Feature |
ALSO OPERATES AT 2.5V
|
FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V
|
| JESD-30 Code |
R-PBGA-B165
|
R-PBGA-B165
|
| Length |
15 mm
|
15 mm
|
| Memory Density |
16777216 bit
|
16777216 bit
|
| Memory IC Type |
CACHE SRAM
|
CACHE SRAM
|
| Memory Width |
32
|
32
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
165
|
165
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
512KX32
|
512KX32
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Seated Height-Max |
1.4 mm
|
1.4 mm
|
| Supply Voltage-Max (Vsup) |
2 V
|
2.7 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
13 mm
|
13 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare GS816132DGD-200V with alternatives
Compare GS816132DD-375T with alternatives