GT28F640W30BD70 vs GE28F640W30B85 feature comparison

GT28F640W30BD70 Intel Corporation

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GE28F640W30B85 Intel Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEL CORP INTEL CORP
Part Package Code BGA BGA
Package Description 0.75 MM PITCH, MICRO, BGA-56 0.75 MM PITCH, VFBGA-56
Pin Count 56 56
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 85 ns
Additional Feature SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Boot Block BOTTOM BOTTOM
JESD-30 Code R-PBGA-B56 R-PBGA-B56
Length 9 mm 9 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 56 56
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 1.8 V 1.8 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 1.9 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 7.7 mm 7.7 mm
Base Number Matches 1 1
Command User Interface YES
Common Flash Interface YES
Data Polling NO
Number of Sectors/Size 8,127
Package Equivalence Code BGA56,7X8,30
Page Size 4 words
Sector Size 4K,32K
Standby Current-Max 0.000005 A
Supply Current-Max 0.04 mA
Toggle Bit NO

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