GT28F640W30BD70
vs
M58WR064FB70ZB6E
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
NUMONYX
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
0.75 MM PITCH, MICRO, BGA-56
|
7.70 X 9 MM, 0.75 MM PITCH, LEAD FREE, VFBGA-56
|
| Pin Count |
56
|
56
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
70 ns
|
70 ns
|
| Additional Feature |
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
|
SYNCHRONOUS BURST MODE OPERATION POSSIBLE
|
| Boot Block |
BOTTOM
|
BOTTOM
|
| JESD-30 Code |
R-PBGA-B56
|
R-PBGA-B56
|
| Length |
9 mm
|
9 mm
|
| Memory Density |
67108864 bit
|
67108864 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
56
|
56
|
| Number of Words |
4194304 words
|
4194304 words
|
| Number of Words Code |
4000000
|
4000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
4MX16
|
4MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
1.8 V
|
1.8 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
1.9 V
|
2 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.75 mm
|
0.75 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
7.7 mm
|
7.7 mm
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare GT28F640W30BD70 with alternatives
Compare M58WR064FB70ZB6E with alternatives