HCPL-7860
vs
HCPL-7860-E
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
AVAGO TECHNOLOGIES INC
|
AVAGO TECHNOLOGIES INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP,
|
DIP,
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Avago Technologies
|
|
| Analog Input Voltage-Max |
0.32 V
|
0.32 V
|
| Analog Input Voltage-Min |
-0.32 V
|
-0.32 V
|
| Conversion Time-Max |
47 µs
|
47 µs
|
| Converter Type |
ADC, DELTA-SIGMA
|
ADC, DELTA-SIGMA
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
| JESD-609 Code |
e0
|
|
| Length |
9.8 mm
|
9.8 mm
|
| Linearity Error-Max (EL) |
0.0916%
|
0.0916%
|
| Moisture Sensitivity Level |
1
|
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
15
|
15
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Bit Code |
BINARY
|
BINARY
|
| Output Format |
SERIAL
|
SERIAL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.7 mm
|
4.7 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
9
|
1
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|