HD6417750SBP200
vs
IBM25PPC750CXEJP5513T
feature comparison
| Pbfree Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
IBM MICROELECTRONICS
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA, BGA256,20X20,50
|
LBGA, BGA256,20X20,50
|
| Pin Count |
256
|
256
|
| Manufacturer Package Code |
PRBG0256DE
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| Address Bus Width |
26
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
34 MHz
|
133 MHz
|
| External Data Bus Width |
64
|
64
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| JESD-609 Code |
e0
|
|
| Length |
27 mm
|
27 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
75 °C
|
|
| Operating Temperature-Min |
-20 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LBGA
|
| Package Equivalence Code |
BGA256,20X20,50
|
BGA256,20X20,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.1 mm
|
1.666 mm
|
| Speed |
200 MHz
|
533 MHz
|
| Supply Voltage-Max |
2.07 V
|
1.9 V
|
| Supply Voltage-Min |
1.8 V
|
1.7 V
|
| Supply Voltage-Nom |
1.95 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
27 mm
|
27 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
No
|
|
|
|
Compare HD6417750SBP200 with alternatives
Compare IBM25PPC750CXEJP5513T with alternatives