HD74HC595RP-EL vs TC74HC595AFN(TP2) feature comparison

HD74HC595RP-EL Renesas Electronics Corporation

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TC74HC595AFN(TP2) Toshiba America Electronic Components

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Part Life Cycle Code Contact Manufacturer Lifetime Buy
Ihs Manufacturer RENESAS ELECTRONICS CORP TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, 0.150 INCH, PLASTIC, SOIC-16
Pin Count 16 16
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 9.9 mm 9.9 mm
Logic IC Type SERIAL IN PARALLEL OUT SERIAL IN PARALLEL OUT
Number of Terminals 16 16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 2 1
Pbfree Code No
Rohs Code No
Additional Feature PARALLEL OUTPUT IS REGISTERED; UNREGISTERED SERIAL SHIFT RIGHT OUTPUT
Count Direction RIGHT
Load Capacitance (CL) 50 pF
Number of Bits 8
Number of Functions 1
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Characteristics 3-STATE
Output Polarity TRUE
Peak Reflow Temperature (Cel) 240
Propagation Delay (tpd) 31 ns
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Technology CMOS
Temperature Grade INDUSTRIAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
fmax-Min 25 MHz

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Compare TC74HC595AFN(TP2) with alternatives