HEF4050BT
vs
HEF4050BPB
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOIC
|
|
Package Description |
3.90 MM, PLASTIC, MS-012, SOT109-1, SOP-16
|
DIP,
|
Pin Count |
16
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
NXP
|
|
Additional Feature |
CMOS-TTL LEVEL TRANSLATOR
|
CMOS-TTL LEVEL TRANSLATOR
|
Family |
4000/14000/40000
|
4000/14000/40000
|
JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T16
|
JESD-609 Code |
e4
|
|
Length |
9.9 mm
|
21.6 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
BUFFER
|
BUFFER
|
Max I(ol) |
0.00035999999999999997 A
|
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
6
|
6
|
Number of Inputs |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
DIP
|
Package Equivalence Code |
SOP16,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Prop. Delay@Nom-Sup |
110 ns
|
|
Propagation Delay (tpd) |
110 ns
|
70 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
NO
|
|
Seated Height-Max |
1.75 mm
|
4.7 mm
|
Supply Voltage-Max (Vsup) |
15 V
|
15 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3.9 mm
|
7.62 mm
|
Base Number Matches |
8
|
1
|
|
|
|
Compare HEF4050BT with alternatives
Compare HEF4050BPB with alternatives