HFM304
vs
BYW73Z)
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Contact Manufacturer
|
| Ihs Manufacturer |
RECTRON LTD
|
CHANGZHOU GALAXY CENTURY MICROELECTRONICS CO LTD
|
| Part Package Code |
DO-214AB
|
|
| Package Description |
ROHS COMPLIANT, PLASTIC PACKAGE-2
|
|
| Pin Count |
2
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
|
| Additional Feature |
LOW LEAKAGE CURRENT, METALLURGICALLY BONDED
|
|
| Application |
EFFICIENCY
|
GENERAL PURPOSE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.3 V
|
1.1 V
|
| JEDEC-95 Code |
DO-214AB
|
|
| JESD-30 Code |
R-PDSO-C2
|
|
| JESD-609 Code |
e3
|
|
| Non-rep Pk Forward Current-Max |
200 A
|
200 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Output Current-Max |
3 A
|
3 A
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Rep Pk Reverse Voltage-Max |
300 V
|
300 V
|
| Reverse Recovery Time-Max |
0.05 µs
|
0.2 µs
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
C BEND
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
|
| Base Number Matches |
10
|
1
|
|
|
|
Compare HFM304 with alternatives
Compare BYW73Z) with alternatives