HI1-574AKD-8
vs
ADS774TH
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTERSIL CORP
|
MICRO NETWORKS CORP
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP,
|
DIP, DIP28,.6
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
10 V
|
10 V
|
| Analog Input Voltage-Min |
-10 V
|
-10 V
|
| Conversion Time-Max |
25 µs
|
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
R-CDIP-T28
|
R-CDIP-T28
|
| JESD-609 Code |
e0
|
e0
|
| Linearity Error-Max (EL) |
0.0122%
|
0.0183%
|
| Negative Supply Voltage-Nom |
-12 V
|
-15 V
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
75 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Bit Code |
BINARY
|
BINARY, OFFSET BINARY
|
| Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.92 mm
|
4.45 mm
|
| Supply Voltage-Nom |
12 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
15.24 mm
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
3A001.A.2.C
|
| Length |
|
35.56 mm
|
| Package Equivalence Code |
|
DIP28,.6
|
| Sample and Hold / Track and Hold |
|
SAMPLE
|
| Supply Current-Max |
|
24 mA
|
| Technology |
|
CMOS
|
|
|
|
Compare HI1-574AKD-8 with alternatives
Compare ADS774TH with alternatives