HI1-574ASD-8
vs
HADC574ZACD
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
SIGNAL PROCESSING TECHNOLOGIES
|
| Package Description |
DIP, DIP28,.6
|
DIP, DIP28,.6
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
10 V
|
16.5 V
|
| Analog Input Voltage-Min |
-10 V
|
-16.5 V
|
| Conversion Time-Max |
25 µs
|
25 µs
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
R-CDIP-T28
|
R-GDIP-T28
|
| JESD-609 Code |
e0
|
e0
|
| Linearity Error-Max (EL) |
0.0244%
|
0.012%
|
| Negative Supply Voltage-Nom |
-12 V
|
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Bit Code |
BINARY
|
BINARY, 2'S COMPLEMENT BINARY
|
| Output Format |
PARALLEL, 8 BITS, PARALLEL, WORD
|
PARALLEL, WORD
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP28,.6
|
DIP28,.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883 Class B (Modified)
|
|
| Supply Voltage-Nom |
12 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
1
|
| Sample Rate |
|
0.056 MHz
|
| Sample and Hold / Track and Hold |
|
SAMPLE
|
| Supply Current-Max |
|
9 mA
|
|
|
|
Compare HI1-574ASD-8 with alternatives
Compare HADC574ZACD with alternatives