HI5714/6CB
vs
TDA8714/6
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTERSIL CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
PLASTIC, MS-013AD, SOIC-24
|
DIP,
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
3.9 V
|
5 V
|
| Converter Type |
ADC, RESISTANCE LADDER
|
ADC SUBSYSTEM
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDIP-T24
|
| JESD-609 Code |
e0
|
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Bit Code |
BINARY
|
BINARY
|
| Output Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP24,.4
|
DIP24,.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample Rate |
60 MHz
|
75 MHz
|
| Supply Current-Max |
75 mA
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BICMOS
|
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
1
|
| Analog Input Voltage-Min |
|
|
| Length |
|
31.7 mm
|
| Linearity Error-Max (EL) |
|
0.293%
|
| Seated Height-Max |
|
5.1 mm
|
| Width |
|
15.24 mm
|
|
|
|
Compare HI5714/6CB with alternatives
Compare TDA8714/6 with alternatives