HM3-7603-5 vs HM1-7602-5 feature comparison

HM3-7603-5 Intersil Corporation

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HM1-7602-5 Harris Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP HARRIS SEMICONDUCTOR
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 50 ns
JESD-30 Code R-PDIP-T16 R-XDIP-T16
JESD-609 Code e0 e0
Memory Density 256 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1
Number of Terminals 16 16
Number of Words 32 words 32 words
Number of Words Code 32 32
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32X8 32X8
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.13 mA 0.13 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2

Compare HM3-7603-5 with alternatives

Compare HM1-7602-5 with alternatives