HM628512CLFPI-5
vs
MCM6209P20
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
SOIC
Package Description
0.525 INCH, PLASTIC, SOP-32
DIP, DIP28,.3
Pin Count
32
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
55 ns
20 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDSO-G32
R-PDIP-T28
Length
20.45 mm
Memory Density
4194304 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
4
Number of Functions
1
Number of Terminals
32
28
Number of Words
524288 words
65536 words
Number of Words Code
512000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
512KX8
64KX4
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP32,.56
DIP28,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3 mm
Standby Current-Max
0.00001 A
0.02 A
Standby Voltage-Min
2 V
4.5 V
Supply Current-Max
0.025 mA
0.145 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
11.3 mm
Base Number Matches
1
3
Rohs Code
JESD-609 Code
e0
Power Supplies
5 V
Terminal Finish
Tin/Lead (Sn/Pb)
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