HM66WP18100FP-60
vs
HM66WP18101BP-75
feature comparison
| Part Life Cycle Code |
Transferred
|
Contact Manufacturer
|
| Ihs Manufacturer |
HITACHI LTD
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
QFP
|
BGA
|
| Package Description |
LQFP,
|
BGA,
|
| Pin Count |
100
|
119
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
3.5 ns
|
7.5 ns
|
| Additional Feature |
PIPELINED ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY
|
FLOW-THROUGH ARCHITECTURE; CAN ALSO OPERATE AT 3.3V SUPPLY
|
| JESD-30 Code |
R-PQFP-G100
|
R-PBGA-B119
|
| Length |
20 mm
|
22 mm
|
| Memory Density |
18874368 bit
|
18874368 bit
|
| Memory IC Type |
ZBT SRAM
|
ZBT SRAM
|
| Memory Width |
18
|
18
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
100
|
119
|
| Number of Words |
1048576 words
|
1048576 words
|
| Number of Words Code |
1000000
|
1000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
1MX18
|
1MX18
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
BGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK, LOW PROFILE
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
2.35 mm
|
| Supply Voltage-Max (Vsup) |
2.625 V
|
2.625 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
2
|
2
|
| JESD-609 Code |
|
e1
|
| Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
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