HSMBJ5915DE3
vs
3SMBJ5915B-TP-HF
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICRO COMMERCIAL COMPONENTS CORP
|
| Part Package Code |
DO-214AA
|
|
| Package Description |
R-PDSO-C2
|
|
| Pin Count |
2
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Configuration |
SINGLE
|
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
7.5 Ω
|
|
| JEDEC-95 Code |
DO-214AA
|
|
| JESD-30 Code |
R-PDSO-C2
|
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Elements |
1
|
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
150 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE
|
|
| Polarity |
UNIDIRECTIONAL
|
|
| Power Dissipation-Max |
1.56 W
|
|
| Qualification Status |
Not Qualified
|
|
| Reference Voltage-Nom |
3.9 V
|
|
| Surface Mount |
YES
|
|
| Technology |
ZENER
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
C BEND
|
|
| Terminal Position |
DUAL
|
|
| Voltage Tol-Max |
1%
|
|
| Working Test Current |
96.1 mA
|
|
| Base Number Matches |
1
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
10
|
|
|
|
Compare HSMBJ5915DE3 with alternatives
Compare 3SMBJ5915B-TP-HF with alternatives