HSMP-3814-BLKG
vs
LSP1002-454-2
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
AGILENT TECHNOLOGIES INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SOT-23
|
|
| Package Description |
SOT-23, 3 PIN
|
R-PDSO-N3
|
| Pin Count |
3
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Additional Feature |
LOW DISTORTION
|
LOW DISTORTION
|
| Application |
ATTENUATOR
|
ATTENUATOR
|
| Breakdown Voltage-Min |
100 V
|
100 V
|
| Configuration |
COMMON CATHODE, 2 ELEMENTS
|
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
| Diode Capacitance-Max |
0.35 pF
|
0.32 pF
|
| Diode Capacitance-Nom |
0.27 pF
|
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Forward Resistance-Max |
3 Ω
|
4 Ω
|
| Diode Type |
PIN DIODE
|
PIN DIODE
|
| JESD-30 Code |
R-PDSO-G3
|
R-PDSO-N3
|
| JESD-609 Code |
e3
|
|
| Minority Carrier Lifetime-Nom |
1.5 µs
|
1.5 µs
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
2
|
2
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
150 °C
|
125 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Power Dissipation-Max |
0.25 W
|
0.5 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reverse Test Voltage |
50 V
|
50 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
| Terminal Finish |
TIN
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Diode Res Test Current |
|
100 mA
|
| Diode Res Test Frequency |
|
100 MHz
|
| Frequency Band |
|
VERY HIGH FREQUENCY TO C BAND
|
| Operating Temperature-Min |
|
-65 °C
|
|
|
|
Compare HSMP-3814-BLKG with alternatives
Compare LSP1002-454-2 with alternatives