HSMP-3880-TR2G
vs
HSMP-386J-BLKG
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
AGILENT TECHNOLOGIES INC
|
BROADCOM LTD
|
| Package Description |
R-PDSO-G3
|
S-PDSO-N8
|
| Pin Count |
3
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Additional Feature |
LOW DISTORTION
|
LOW DISTORTION
|
| Application |
SWITCHING
|
SWITCHING
|
| Breakdown Voltage-Min |
100 V
|
100 V
|
| Configuration |
SINGLE
|
COMPLEX
|
| Diode Capacitance-Max |
0.4 pF
|
1.25 pF
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Forward Resistance-Max |
6.5 Ω
|
0.77 Ω
|
| Diode Res Test Current |
5 mA
|
50 mA
|
| Diode Res Test Frequency |
100 MHz
|
100 MHz
|
| Diode Type |
PIN DIODE
|
PIN DIODE
|
| Frequency Band |
L BAND
|
L BAND
|
| JESD-30 Code |
R-PDSO-G3
|
S-PDSO-N8
|
| JESD-609 Code |
e3
|
e3
|
| Minority Carrier Lifetime-Nom |
2.5 µs
|
0.26 µs
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Elements |
1
|
8
|
| Number of Terminals |
3
|
8
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Power Dissipation-Max |
0.25 W
|
2 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
| Terminal Finish |
TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
2
|
| Samacsys Manufacturer |
|
Avago Technologies
|
| Diode Capacitance-Nom |
|
1.2 pF
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Reverse Test Voltage |
|
50 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare HSMP-3880-TR2G with alternatives
Compare HSMP-386J-BLKG with alternatives