HUM2020B
vs
HUM2020B
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
HERMETIC SEALED, AXIAL PACKAGE-2
|
HERMETIC SEALED, AXIAL PACKAGE-2
|
Pin Count |
2
|
|
Manufacturer Package Code |
CASE B
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.80
|
|
Additional Feature |
HIGH RELIABILITY
|
HIGH RELIABILITY
|
Application |
SWITCHING
|
SWITCHING
|
Breakdown Voltage-Min |
2000 V
|
2000 V
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Capacitance-Max |
4 pF
|
4 pF
|
Diode Capacitance-Nom |
3.4 pF
|
3.4 pF
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Forward Resistance-Max |
0.2 Ω
|
0.2 Ω
|
Diode Res Test Current |
500 mA
|
500 mA
|
Diode Res Test Frequency |
4 MHz
|
4 MHz
|
Diode Type |
PIN DIODE
|
PIN DIODE
|
JESD-30 Code |
O-XALF-W2
|
O-XALF-W2
|
JESD-609 Code |
e0
|
e0
|
Minority Carrier Lifetime-Nom |
30 µs
|
30 µs
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Power Dissipation-Max |
13 W
|
13 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reverse Test Voltage |
100 V
|
100 V
|
Surface Mount |
NO
|
NO
|
Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Base Number Matches |
2
|
1
|
|
|
|