HVC369B-E
vs
BB640
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
RENESAS TECHNOLOGY CORP
|
SIEMENS A G
|
| Package Description |
R-PDSO-F2
|
|
| Pin Count |
2
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Cap Tolerance |
5.1%
|
|
| Diode Capacitance Ratio-Min |
2.3
|
19.5
|
| Diode Capacitance-Nom |
4.9 pF
|
7.6 pF
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
VARIABLE CAPACITANCE DIODE
|
VARIABLE CAPACITANCE DIODE
|
| JESD-30 Code |
R-PDSO-F2
|
R-PDSO-G2
|
| JESD-609 Code |
e6
|
e0
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN BISMUTH
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
FLAT
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Base Number Matches |
1
|
2
|
| Breakdown Voltage-Min |
|
30 V
|
| Rep Pk Reverse Voltage-Max |
|
30 V
|
| Reverse Current-Max |
|
0.01 µA
|
| Reverse Test Voltage |
|
30 V
|
|
|
|
Compare HVC369B-E with alternatives
Compare BB640 with alternatives