HVU350B vs BB181,335 feature comparison

HVU350B Renesas Electronics Corporation

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BB181,335 NXP Semiconductors

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP NXP SEMICONDUCTORS
Package Description ULTRA SMALL, URP, 2 PIN
Pin Count 2 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.80 8541.10.00
Configuration SINGLE SINGLE
Diode Cap Tolerance 4.62%
Diode Capacitance Ratio-Min 2.8 12
Diode Capacitance-Nom 16.25 pF 12.5 pF
Diode Element Material SILICON
Diode Type VARIABLE CAPACITANCE DIODE VARIABLE CAPACITANCE DIODE
JESD-30 Code R-PDSO-G2
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 2
Operating Temperature-Max 125 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Qualification Status Not Qualified
Rep Pk Reverse Voltage-Max 15 V 30 V
Surface Mount YES YES
Terminal Finish TIN LEAD Tin (Sn)
Terminal Form GULL WING
Terminal Position DUAL
Variable Capacitance Diode Classification ABRUPT ABRUPT
Base Number Matches 2 1
Part Package Code SOD
Manufacturer Package Code SOD523
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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