HY628100BLLT1-55I vs K6X1008C2D-BF55T feature comparison

HY628100BLLT1-55I SK Hynix Inc

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K6X1008C2D-BF55T Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SK HYNIX INC SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP1 SOIC
Package Description 8 X 20 MM, TSOP1-32 0.525 INCH, LEAD FREE, PLASTIC, SOP-32
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDSO-G32 R-PDSO-G32
JESD-609 Code e6
Length 18.4 mm 20.47 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 SOP
Package Equivalence Code TSSOP32,.8,20 SOP32,.56
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 3 mm
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.05 mA 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN BISMUTH
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position DUAL DUAL
Width 8 mm 11.43 mm
Base Number Matches 1 1
Rohs Code Yes
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 225
Standby Current-Max 0.00001 A

Compare HY628100BLLT1-55I with alternatives

Compare K6X1008C2D-BF55T with alternatives