HYB3165165BTL-50 vs K4E661612C-TC50 feature comparison

HYB3165165BTL-50 Siemens

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K4E661612C-TC50 Samsung Semiconductor

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer SIEMENS A G SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP2 TSOP2
Package Description , TSOP2, TSOP50,.46,32
Pin Count 50 50
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Mode FAST PAGE WITH EDO FAST PAGE WITH EDO
Access Time-Max 50 ns 50 ns
JESD-30 Code R-PDSO-G50 R-PDSO-G50
Memory Density 67108864 bit 67108864 bit
Memory IC Type EDO DRAM EDO DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 50 50
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Base Number Matches 2 1
Rohs Code No
Additional Feature RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O Type COMMON
JESD-609 Code e0
Length 20.95 mm
Output Characteristics 3-STATE
Package Code TSOP2
Package Equivalence Code TSOP50,.46,32
Refresh Cycles 8192
Seated Height-Max 1.2 mm
Self Refresh NO
Standby Current-Max 0.0005 A
Supply Current-Max 0.12 mA
Terminal Finish TIN LEAD
Terminal Pitch 0.8 mm
Width 10.16 mm

Compare HYB3165165BTL-50 with alternatives

Compare K4E661612C-TC50 with alternatives