ICB2FL02G
vs
MAX6765TTSD2/V+
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
|
| Part Package Code |
SOIC
|
6-LFCSP-3X3X0.75
|
| Package Description |
SOP-20/19
|
|
| Pin Count |
20/19
|
6
|
| Reach Compliance Code |
compliant
|
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
IT ALSO HAS VCC=10 to 18V at 125-degree centigrade
|
RESET THRESHOLD VOLTAGE IS 2.888V
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| JESD-30 Code |
R-PDSO-G19
|
S-PDSO-N6
|
| Length |
12.8 mm
|
3 mm
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
19
|
6
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-25 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
HVSON
|
| Package Equivalence Code |
SOP19/20,.4
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.65 mm
|
0.8 mm
|
| Supply Voltage-Max (Vsup) |
17.5 V
|
72 V
|
| Supply Voltage-Min (Vsup) |
10 V
|
4 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
14 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
7.6 mm
|
3 mm
|
| Base Number Matches |
1
|
2
|
| Manufacturer Package Code |
|
6-LFCSP-3X3X0.75
|
| Date Of Intro |
|
2006-11-01
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Technology |
|
BICMOS
|
| Terminal Finish |
|
Matte Tin (Sn)
|
|
|
|
Compare ICB2FL02G with alternatives
Compare MAX6765TTSD2/V+ with alternatives