ICL7135CPI+
vs
TC835C/BU
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
28-PDIP-600_MIL
|
QFP
|
Package Description |
PLASTIC, DIP-28
|
QFP, QFP64,.66SQ,32
|
Pin Count |
28
|
64
|
Manufacturer Package Code |
28-PDIP-600_MIL
|
|
Reach Compliance Code |
compliant
|
compliant
|
Date Of Intro |
1987-02-01
|
|
Samacsys Manufacturer |
Analog Devices
|
|
Analog Input Voltage-Max |
2 V
|
2 V
|
Analog Input Voltage-Min |
-2 V
|
-2 V
|
Converter Type |
ADC, DUAL-SLOPE
|
ADC, DUAL-SLOPE
|
JESD-30 Code |
R-PDIP-T28
|
S-PQFP-G64
|
JESD-609 Code |
e3
|
e3
|
Length |
36.83 mm
|
14 mm
|
Linearity Error-Max (EL) |
0.0977%
|
0.005%
|
Moisture Sensitivity Level |
1
|
|
Negative Supply Voltage-Nom |
-5 V
|
-5 V
|
Number of Analog In Channels |
1
|
1
|
Number of Bits |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
64
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Output Bit Code |
BINARY, BINARY CODED DECIMAL
|
BINARY CODED DECIMAL
|
Output Format |
PARALLEL, 4 BITS
|
PARALLEL, 4 BITS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
QFP
|
Package Equivalence Code |
DIP28,.6
|
QFP64,.66SQ,32
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
IN-LINE
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.445 mm
|
3.15 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
0.8 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Width |
15.24 mm
|
14 mm
|
Base Number Matches |
2
|
2
|
HTS Code |
|
8542.39.00.01
|
|
|
|
Compare ICL7135CPI+ with alternatives
Compare TC835C/BU with alternatives