ID2732
vs
B2732
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Package Description |
Dip, Dip24,.6
|
Dip, Dip24,.6
|
| Reach Compliance Code |
Compliant
|
Unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.61
|
8542.32.00.61
|
| Access Time-Max |
450 Ns
|
|
| I/O Type |
Common
|
Common
|
| JESD-30 Code |
R-XDIP-T24
|
R-GDIP-T24
|
| JESD-609 Code |
e0
|
|
| Memory Density |
32768 Bit
|
32768 Bit
|
| Memory IC Type |
Uvprom
|
Uvprom
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Number of Words |
4096 Words
|
4096 Words
|
| Number of Words Code |
4000
|
4000
|
| Operating Mode |
Asynchronous
|
Asynchronous
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Organization |
4kx8
|
4kx8
|
| Output Characteristics |
3-State
|
3-State
|
| Package Body Material |
Ceramic
|
Ceramic, Glass-Sealed
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP24,.6
|
DIP24,.6
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
In-Line
|
In-Line
|
| Parallel/Serial |
Parallel
|
Parallel
|
| Programming Voltage |
25 V
|
21 V
|
| Qualification Status |
Not Qualified
|
|
| Supply Current-Max |
0.1 Ma
|
0.115 Ma
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
No
|
No
|
| Technology |
Mos
|
Hmos
|
| Temperature Grade |
Industrial
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
Through-Hole
|
Through-Hole
|
| Terminal Pitch |
2.54 Mm
|
|
| Terminal Position |
Dual
|
Dual
|
| Base Number Matches |
2
|
2
|
| Peak Reflow Temperature (Cel) |
|
Not Specified
|
| Standby Current-Max |
|
0.035 A
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
Not Specified
|
|
|
|