IDT71V3557SA75BGI8 vs HM6AEB18202BPL50 feature comparison

IDT71V3557SA75BGI8 Integrated Device Technology Inc

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HM6AEB18202BPL50 Renesas Electronics Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC RENESAS ELECTRONICS CORP
Part Package Code BGA BGA
Package Description 14 X 22 MM, PLASTIC, BGA-119 15 X 17 MM, 1 MM PITCH, PLASTIC, FBGA-165
Pin Count 119 165
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 7.5 ns 0.45 ns
Additional Feature FLOW-THROUGH ARCHITECTURE
JESD-30 Code R-PBGA-B119 R-PBGA-B165
JESD-609 Code e0 e0
Length 22 mm 17 mm
Memory Density 4718592 bit 37748736 bit
Memory IC Type ZBT SRAM DDR SRAM
Memory Width 36 18
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 119 165
Number of Words 131072 words 2097152 words
Number of Words Code 128000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128KX36 2MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.36 mm 1.46 mm
Supply Voltage-Max (Vsup) 3.465 V 1.9 V
Supply Voltage-Min (Vsup) 3.135 V 1.7 V
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 14 mm 15 mm
Base Number Matches 1 1
Pbfree Code No

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Compare HM6AEB18202BPL50 with alternatives