IDT7200L50J8 vs IDT7200L50TPB feature comparison

IDT7200L50J8 Integrated Device Technology Inc

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IDT7200L50TPB Integrated Device Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFJ DIP
Package Description PLASTIC, LCC-32 THIN, PLASTIC, DIP-28
Pin Count 32 28
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 50 ns
Additional Feature RETRANSMIT
Clock Frequency-Max (fCLK) 15 MHz
Cycle Time 65 ns 65 ns
JESD-30 Code R-PQCC-J32 R-PDIP-T28
JESD-609 Code e0 e0
Length 13.97 mm 34.67 mm
Memory Density 2304 bit 2304 bit
Memory IC Type OTHER FIFO
Memory Width 9 9
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 32 28
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 256X9 256X9
Output Characteristics 3-STATE
Output Enable NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ DIP
Package Equivalence Code LDCC32,.5X.6
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.55 mm 4.57 mm
Standby Current-Max 0.0005 A
Supply Current-Max 0.08 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn85Pb15) TIN LEAD
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 20
Width 11.43 mm 7.62 mm
Base Number Matches 1 1

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