IDT7200S35TC vs IDT7200S35XE feature comparison

IDT7200S35TC Integrated Device Technology Inc

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IDT7200S35XE Integrated Device Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP DFP
Package Description 0.300 INCH, SIDE BRAZED, THIN, CERAMIC, DIP-28 CERPACK-28
Pin Count 28 28
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 35 ns 35 ns
Additional Feature RETRANSMIT RETRANSMIT
Cycle Time 45 ns 45 ns
JESD-30 Code R-CDIP-T28 R-GDFP-F28
JESD-609 Code e0 e0
Memory Density 2304 bit 2304 bit
Memory IC Type OTHER FIFO
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256X9 256X9
Output Characteristics 3-STATE 3-STATE
Output Enable NO NO
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DFP
Package Equivalence Code DIP28,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.005 A
Supply Current-Max 0.125 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE FLAT
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Length 18.288 mm
Seated Height-Max 2.921 mm
Width 12.446 mm

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