IDT72V01L35JG8
vs
IDT7201LA35PG
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
QFJ
|
DIP
|
Package Description |
QCCJ,
|
0.600 INCH, PLASTIC, DIP-28
|
Pin Count |
32
|
28
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Access Time-Max |
35 ns
|
25 ns
|
Additional Feature |
RETRANSMIT
|
RETRANSMIT
|
Cycle Time |
45 ns
|
35 ns
|
JESD-30 Code |
R-PQCC-J32
|
R-PDIP-T28
|
JESD-609 Code |
e3
|
e3
|
Length |
13.97 mm
|
36.576 mm
|
Memory Density |
4608 bit
|
147456 bit
|
Memory Width |
9
|
9
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
28
|
Number of Words |
512 words
|
512 words
|
Number of Words Code |
512
|
16000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
512X9
|
16KX9
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Enable |
NO
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.55 mm
|
4.699 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
|
Supply Voltage-Min (Vsup) |
3 V
|
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
J BEND
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
11.43 mm
|
15.24 mm
|
Base Number Matches |
1
|
1
|
Memory IC Type |
|
OTHER FIFO
|
Supply Current-Max |
|
0.155 mA
|
|
|
|
Compare IDT72V01L35JG8 with alternatives
Compare IDT7201LA35PG with alternatives