IDT72V245L20TFG
vs
LH54V0245M-25
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
SHARP CORP
|
| Part Package Code |
QFP
|
|
| Package Description |
GREEN, PLASTIC, STQFP-64
|
14 X 14 MM, PLASTIC, TQFP-64
|
| Pin Count |
64
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.71
|
|
| Access Time-Max |
12 ns
|
17 ns
|
| Additional Feature |
EASILY EXPANDABLE IN DEPTH AND WIDTH
|
|
| Cycle Time |
20 ns
|
25 ns
|
| JESD-30 Code |
S-PQFP-G64
|
S-PQFP-G64
|
| JESD-609 Code |
e3
|
e0
|
| Length |
10 mm
|
14 mm
|
| Memory Density |
73728 bit
|
73728 bit
|
| Memory Width |
18
|
18
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
64
|
| Number of Words |
4096 words
|
4096 words
|
| Number of Words Code |
4000
|
4000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
4KX18
|
4KX18
|
| Output Enable |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
LQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK, LOW PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
10 mm
|
14 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare IDT72V245L20TFG with alternatives
Compare LH54V0245M-25 with alternatives