IDT72V3670L6BBG
vs
72V3670L6BB8
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
BGA
|
PBGA
|
| Package Description |
BGA, BGA144,12X12,40
|
13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144
|
| Pin Count |
144
|
144
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
4 ns
|
4 ns
|
| Additional Feature |
RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE
|
RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE
|
| Clock Frequency-Max (fCLK) |
166 MHz
|
100 MHz
|
| Cycle Time |
6 ns
|
6 ns
|
| JESD-30 Code |
S-PBGA-B144
|
S-PBGA-B144
|
| JESD-609 Code |
e1
|
e0
|
| Length |
13 mm
|
13 mm
|
| Memory Density |
294912 bit
|
294912 bit
|
| Memory IC Type |
OTHER FIFO
|
OTHER FIFO
|
| Memory Width |
36
|
36
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
144
|
144
|
| Number of Words |
8192 words
|
8192 words
|
| Number of Words Code |
8000
|
8000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
8KX36
|
8KX36
|
| Output Enable |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA144,12X12,40
|
BGA144,12X12,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
225
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.97 mm
|
1.97 mm
|
| Standby Current-Max |
0.015 A
|
0.015 A
|
| Supply Current-Max |
0.04 mA
|
0.04 mA
|
| Supply Voltage-Max (Vsup) |
3.45 V
|
3.45 V
|
| Supply Voltage-Min (Vsup) |
3.15 V
|
3.15 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Width |
13 mm
|
13 mm
|
| Base Number Matches |
1
|
2
|
| Manufacturer Package Code |
|
BB144
|
| Date Of Intro |
|
1998-10-01
|
|
|
|
Compare IDT72V3670L6BBG with alternatives
Compare 72V3670L6BB8 with alternatives