IDT72V3670L6PFG8 vs 72V3670L6BBG8 feature comparison

IDT72V3670L6PFG8 Integrated Device Technology Inc

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72V3670L6BBG8 Renesas Electronics Corporation

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC RENESAS ELECTRONICS CORP
Part Package Code QFP
Package Description LFQFP, BGA-144
Pin Count 128
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 4 ns 4 ns
Additional Feature RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE
Cycle Time 6 ns 6 ns
JESD-30 Code R-PQFP-G128 S-PBGA-B144
JESD-609 Code e3
Length 20 mm 13 mm
Memory Density 294912 bit 294912 bit
Memory Width 36 36
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 128 144
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8KX36 8KX36
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP BGA
Package Shape RECTANGULAR SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.6 mm 1.97 mm
Supply Voltage-Max (Vsup) 3.45 V 3.45 V
Supply Voltage-Min (Vsup) 3.15 V 3.15 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 14 mm 13 mm
Base Number Matches 1 2
Memory IC Type OTHER FIFO

Compare IDT72V3670L6PFG8 with alternatives

Compare 72V3670L6BBG8 with alternatives