IMP1834/D
vs
ASM1834AF
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
IMP INC
|
ALLIANCE SEMICONDUCTOR CORP
|
Package Description |
DIE,
|
DIP, DIP8,.3
|
Reach Compliance Code |
unknown
|
unknown
|
Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT
|
VOLTAGE SUPERVISOR/RESET IC
|
JESD-30 Code |
X-XUUC-N8
|
R-PDIP-T8
|
Number of Terminals |
8
|
8
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
DIE
|
DIP
|
Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
NO
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Position |
UPPER
|
DUAL
|
Base Number Matches |
5
|
2
|
Rohs Code |
|
Yes
|
Part Package Code |
|
DIP
|
Pin Count |
|
8
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
Additional Feature |
|
BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:N;WWD:N
|
Adjustable Threshold |
|
NO
|
JESD-609 Code |
|
e3/e6
|
Length |
|
9.59 mm
|
Number of Channels |
|
2
|
Number of Functions |
|
1
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Equivalence Code |
|
DIP8,.3
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Supply Current-Max (Isup) |
|
0.03 mA
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
1.2 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
MATTE TIN/TIN BISMUTH
|
Terminal Pitch |
|
2.54 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
7.62 mm
|
|
|
|
Compare IMP1834/D with alternatives
Compare ASM1834AF with alternatives